https://doi.org/10.17113/ftb.57.03.19.6146

    


Microencapsulation of Red Sorghum Phenolic Compounds with Esterified Sorghum Starch as Encapsulant Materials by Spray Drying


Adriana García-Gurrola¹, Susana Rincón¹, Alberto A. Escobar-Puentes¹, Alejandro Zepeda² and Fernando Martínez-Bustos<sup>3  


1</sup>National Technological Institute of Mexico/I.T. Mérida, Av. Tecnológico km 4.5 S/N, C.P. 97118 Merida, Yucatan, Mexico
²Autonomous University of Yucatan, Periferico Norte kilómetro 33.5, Chuburna de Hidalgo Inn, C.P. 97203 Mérida, Yucatan, Mexico
³Center for Research and Advanced Studies of the IPN, campus Queretaro Libramiento Norponiente 2000, Fracc. Real de Juriquilla, C.P. 76230 
  Santiago de Queretaro, Queretaro, Mexico




Article history:
Received: 22 November 2018
Accepted: 23 May 2019





Key words:
microencapsulation, sorghum phenolic compounds, sorghum starch, esterification, extrusion




Summary:
Phenolic compounds with antioxidant properties are highly sensitive molecules, which limits their application. In response, extruded esterified starch has been proposed as efficient encapsulating material. In this work, we aim to describe the encapsulation of red sorghum phenolic compounds by spray drying using extruded phosphorylated, acetylated and double esterified sorghum starch as wall material. Their respective encapsulation yields were 77.4, 67.4 and 56.8 %, and encapsulation efficiency 91.4, 89.7 and 84.6 %. Degree of substitution confirmed esterification of the sorghum starch and Fourier transform infrared spectroscopy showed the significant chemical and structural changes in the extruded esterified starch loaded with phenolic compounds. Microcapsules from phosphorylated sorghum starch showed the highest endothermic transition (173.89 °C) and provided a greater protection of the phenolic compounds during storage at 60 °C for 35 days than the other wall materials. Extruded esterified sorghum starch proved to be effective material for the protection of phenolic compounds due to its high encapsulation efficiency and stability during storage.





*Corresponding author:    +524422119905
                                             +524422119938
                                              fmartinez@cinvestav.mx